features bidirectional tvs 3.3 v low capacitance - 13 pf esd protection >15 kv fits 0402 footprint rohs compliant* applications computers and peripherals communication systems audio & video equipment portable instrumentation thermal characteristics (@ t a = 25 ? unless otherwise noted) cddfn2-t3.3lc - surface mount tvs diode *rohs directive 2002/95/ec jan. 27, 2003 including annex and rohs recast 2011/65/eu june 8, 2011. speci cations are subject to change without notice. customers should verify actual device performance in their speci c applications. parameter symbol min. typ. max. unit operating supply voltage v dc -3.8 3.8 v peak pulse current @ 8/20 si pp 5a operating temperature t opr -55 +25 +125 ? storage temperature t stg -55 +25 +150 ? general information the bourns model cddfn2-t3.3lc low capacitance device provides esd, eft and surge protection for external ports of electronic devices such as cellular phones, handheld electronics and other portable electronic devices. the device measures 1.0 mm x 0.60 mm x 0.55 mm and is available in a dfn-2 package and is intended to be mounted directly onto an fr4 printed circuit board. the device will t a 0402 footprint. the device is designed to meet iec 61000-4-2 (esd), iec 61000-4-4 (eft) and iec 61000-4-5 (surge) protection requirements. electrical characteristics (@ t a = 25 ? unless otherwise noted) parameter symbol min. typ. max. unit working peak voltage v wm 3.0 3.3 v breakdown voltage @ 1 ma v br 4 6.5 v leakage current @ 3.3 v i l 0.1 1.0 a capacitance @ 0 v, 1 mhz c j 13 16.5 pf clamping voltage @ i p = 1 a 8/20 sv c 5.0 6.5 v clamping voltage @ i pp = 5 a 8/20 sv c 6.5 8 v esd protection per iec 61000-4-2 contact discharge air discharge esd esd 8 15 kv kv eft protection per iec 61000-4-4 @ 5/50 ns eft 50 a eft protection per iec 61000-4-5 @ 8/20 s surge 5 a *rohs compliant asia-paci c: tel: +886-2 2562-4117 ?fax: +886-2 2562-4116 europe: tel: +41-41 768 5555 ?fax: +41-41 768 5510 the americas: tel: +1-951 781-5500 ?fax: +1-951 781-5700 www.bourns.com
symbol dimensions min. nom. max. a 1.00 (0.039) b 0.60 (0.024) c 0.51 (0.020) 0.55 (0.022) 0.60 (0.024) c1 0.00 (0.000) 0.02 (0.001) 0.05 (0.002) d 0.65 (0.026) e 0.10 (0.004) 0.25 (0.010) 0.35 (0.014) f 0.45 (0.018) 0.60 (0.024) 0.70 (0.028) speci cations are subject to change without notice. customers should verify actual device performance in their speci c applications. cddfn2-t3.3lc - surface mount tvs diode product dimensions block diagram this is a molded dfn-2 package with lead free 100 % sn plating on the terminations. it weighs approximately 30 mg. recommended pcb footprint how to order cd dfn2 - t 3.3 lc common diode chip diode package dfn2 = dfn-2 package model transient voltage suppressor working peak reverse voltage 3.3 = 3.3 v rwm (volts) suf x lc = low capacitance bidirectional diode typical part marking cddfn2-t3.3lc ...........................................................................3l 0.80 (0.031) 0.55 (0.022) 0.30 (0.012) 0.85 (0.033) 1.40 (0.055) 0.55 (0.022) dimensions: mm (inches) a top view side view bottom view b f c c1 e 0.15 (0.006) d 0.05 (0.002) 45 mm (inches) dimensions:
20 40 60 80 100 120 0 030 25 20 15 10 5 i pp ?peak pulse current (% of i pp ) t ?time (?) test waveform parameters t t = 8 ? t d = 20 ? t t e t t d = t | i pp /2 2 0.2 30 25 15 5 -5 -490.00 ns 10.00 ns 510.00 ns 5 volts per division esd test pulse: 25 kilovolt, 1/30 ns (waveshape) 100 80 60 40 20 0 0255075 mounting on glass epoxy pcbs 100 125 150 power rating (%) ambient temperature (?) 16 2 4 6 8 10 12 14 0 -4 input capacitance (pf) input voltage (v) -3 -2 -1 0 1 2 3 4 pin 1 to pin 2 f = 1 mhz, t = 25 ? speci cations are subject to change without notice. customers should verify actual device performance in their speci c applications. cddfn2-t3.3lc - surface mount tvs diode performance graphs pulse waveform overshoot & clamping voltage typical capacitance variation of c in vs v in power derating curve
speci cations are subject to change without notice. customers should verify actual device performance in their speci c applications. cddfn2-t3.3lc - surface mount tvs diode packaging information ....... ....... ....... ....... ....... ....... ....... ....... pa f e t 120 d 2 d d 1 w 1 c index hole p 0 p 1 w b 10 pitches (min.) direction of feed 10 pitches (min.) end trailer device leader start d the surface mount product is packaged in an 8 mm x 4 mm tape and reel format per eia-481 standard. dimensions: mm (inches) item symbol dfn-2 carrier width a 0.80 0.10 (0.031 0.004) carrier length b 1.20 0.10 (0.047 0.004) carrier depth c 0.70 0.10 (0.027 0.004) sprocket hole d 1.55 0.05 (0.061 0.002) reel outside diameter d 178 (7.008) reel inner diameter d 1 50.0 (1.969) min. feed hole diameter d 2 13.0 0.20 (0.512 0.008) sprocket hole position e 1.75 0.10 (0.069 0.004) punch hole position f 3.50 0.05 (0.138 0.002) punch hole pitch p 4.00 0.10 (0.157 0.004) sprocket hole pitch p 0 4.00 0.10 (0.157 0.004) embossment center p 1 2.00 0.05 (0.079 0.002) overall tape thickness t 0.20 0.10 (0.008 0.004) tape width w 8.00 0.20 (0.315 0.008) reel width w 1 14.4 (0.567) max. quantity per reel -- 5000 rev. 02/12
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